基于激光辅助瞬态液相微连接技术的热敏元件气密性封装工艺

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霍永隽,宋佳麒,胡世尊

Hermetic Packaging Process for Thermal Sensitive Components Based on Laser-Assisted Transient Liquid Phase Bonding Technology

电子与封装 . 2024, (6): 60601 . DOI: 10.16257/j.cnki.1681-1070.2024.0134