面向快速散热的HTCC基板微流道性能研究*
孙浩洋,姬峰,冯青华,兰元飞,王建扬,王明伟
Research on Performance of HTCC Substrate Microfluidic Channel for Rapid Heat Dissipation
SUN Haoyang, JI Feng, FENG Qinghua, LAN Yuanfei, WANG Jianyang, WANG Mingwei
电子与封装
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2024, (7): 70203
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DOI: 10.16257/j.cnki.1681-1070.2024.0074
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