高温服役电子元器件的焊接工艺研究<sup>*</sup>

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周阳磊,吕海强,何日吉,周舟

Research on Soldering Process of Electronic Components in High-Temperature Service

ZHOU Yanglei, LYU Haiqiang, HE Riji, ZHOU Zhou

电子与封装 . 2024, (7): 70205 . DOI: 10.16257/j.cnki.1681-1070.2024.0078