中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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基于ATE与结构分析的RRAM芯片测试技术研究
奚留华,徐昊,张凯虹,武乾文,王一伟
Research on RRAM Chip Testing Technology Based on ATE and Structural Analysis
XI Liuhua, XU Hao, ZHANG Kaihong, WU Qianwen, WANG Yiwei
电子与封装 . 2024, (7): 70206 .  DOI: 10.16257/j.cnki.1681-1070.2024.0082