一种耐热、低温固化且强连接的地聚物封装材料

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孙庆磊,李嘉宁,崔粲,李施霖

Heat-Resistant, Low-Curing Temperature, and Strong Bonding Geopolymer Packaging Material

电子与封装 . 2024, (7): 70601 . DOI: 10.16257/j.cnki.1681-1070.2024.0139