铝焊盘镀钯铜丝多焊球脱焊失效的电化学评价
徐艳博;王志杰;刘美;孙志美;牛继勇
Electrochemical Evaluation of Multi-Ball Desoldering Failure with Palladium-Plated Copper Wire Solder Balls on Aluminum Pads
XU Yanbo, WANG Zhijie, LIU Mei, SUN Zhimei, NIU Jiyong
电子与封装
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2024, (8): 80205
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DOI: 10.16257/j.cnki.1681-1070.2022.0093
