基于能量最小化的CCGA焊点形态仿真研究*
张威;刘坤鹏;王宏;杭春进;王尚;田艳红
Simulation Study on CCGA Solder Joint Morphology Based on Energy Minimization
ZHANG Wei, LIU Kunpeng, WANG Hong, HANG Chunjin, WANG Shang, TIAN Yanhong
电子与封装
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2024, (8): 80208
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DOI: 10.16257/j.cnki.1681-1070.2024.0103
