倒装芯片焊点缺陷无损检测技术

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李可;朱逸;顾杰斐;赵新维;宿磊;MichaelPecht

Non-Destructive Detection Technology for Solder Joint Defects of Flip Chip

LI Ke, ZHU Yi, GU Jiefei, ZHAO Xinwei, SU Lei, Michael Pecht

电子与封装 . 2024, (9): 90204 . DOI: 10.16257/j.cnki.1681-1070.2024.0110