Cu/SAC305/Cu焊点界面Ag和Sn扩散差异性研究<sup>*</sup>

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黄哲;郑耀庭;姚尧

Study on the Diffusion Difference of Ag and Sn at Cu/SAC305/Cu Solder Joint Interface

HUANG Zhe, ZHENGYaoting, YAO Yao

电子与封装 . 2024, (9): 90205 . DOI: 10.16257/j.cnki.1681-1070.2024.0117