键合参数对电镀金键合性能的影响*
王世春;沈若尧;任长友;张欣桐;武帅;邓川;王彤;郭可升;刘宏;郝志峰
Influence of Bonding Parameters on the Bonding Performance of Electroplated Gold
WANG Shichun, SHEN Ruoyao, REN Changyou, ZHANG Xintong, WU Shuai, DENG Chuan, WANG Tong, GUO Kesheng, LIU Hong, HAO Zhifeng
电子与封装
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2024, (9): 90206
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DOI: 10.16257/j.cnki.1681-1070.2024.0120
