集成电路异构集成封装技术进展

导航

陈祎;岳琨;吕复强;姚大平

Advances in Heterogeneous Integration Packaging Technology of Integrated Circuits

CHEN Yi, YUE Kun, LYU Fuqiang,YAO Daping

电子与封装 . 2024, (9): 90207 . DOI: 10.16257/j.cnki.1681-1070.2024.0125