中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
厚膜印刷陶瓷基板的版内电阻一致性改进
焦峰;邹欣;陈明祥
Improvement of the Intra Plate Resistance Consistency of the Thick Film Printed Ceramic Substrates
JIAO Feng, ZOU Xin,CHEN Mingxiang
电子与封装 . 2024, (9): 90402 .  DOI: 10.16257/j.cnki.1681-1070.2024.0114