微混装焊料组织及力学性能研究进展

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张尚;张墅野;何鹏

Research Progress on Microstructures andMechanical Properties of Composite Solder

ZHANG Shang, ZHANG Shuye, HE Peng

电子与封装 . 2021, (8): 80101 . DOI: 10.16257/j.cnki.1681-1070.2021.0801