关键词: 封装工艺, 技术解决方案

Abstract: To meet the growing demand in the market of magnetic sensor, the assembly technology research for SSDIP package is elaborated in this paper, focusing on assembly processes and solutions against the special application requirements of magnetic sensor. The smooth mass production and robust quality is demonstrated in this paper, by selecting correct raw material of lead frame and its mistake proof design, controlling D.A.M, proper wire bonding processes, anti-flash processes after molding, automatic on-load method and special packing method to prevent bent lead for this very long lead package.

Key words: assembly processes, technical solutions