中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航

电子与封装 ›› 2018, Vol. 18 ›› Issue (2): 46 -48. doi: 10.16257/j.cnki.1681-1070.2018.0022

• 微电子制造与可靠性 • 上一篇    

基于共享Buffer的LIGBT和PLDMOS器件研究

张恩阳,黄勇,孟令锋,代高强   

  1. 四川长虹电器股份有限公司,四川 绵阳 621000
  • 收稿日期:2017-11-02 出版日期:2018-02-20 发布日期:2018-02-20
  • 作者简介:张恩阳(1964—),男,回族,四川成都人,高级工程师,1985年毕业于成都电讯工程学院(现电子科技大学)无线电专业,主要从事集成电路、新型智能终端研发,长虹技术中心总经理,获得国家科技进步二等奖一次,四川省科技进步二等奖一次,绵阳市科技进步奖三次。

The LIGBT and PLDMOS with Shared Buffer

ZHANG Enyang,HUANG Yong,MENG Lingfeng,DAI Gaoqiang   

  1. ChangHong Electric Co.,Ltd.,Mianyang 621000,China
  • Received:2017-11-02 Online:2018-02-20 Published:2018-02-20

摘要: 介绍了基于共享Buffer技术的SOI(绝缘体上硅) LIGBT和PLDMOS,相对于传统工艺可以节约2层光刻板和2步工艺流程。主要通过研究在器件漏区的缓冲层特性,对器件特性影响明显。通过实验和仿真结果对比,共享Buffer技术的器件通过工艺和版图优化后能达到原有器件的表现性能。

关键词: 绝缘体上硅, LIGBT, PLDMOS, 共享Buffer

Abstract: The SOI(Silicon-On-Insulator)LIGBT(lateral insulated gate bipolar transistor)and PLDMOS(lateral double-diffused MOS),which based the shared masks,are presented in this paper.The proposed process using Shared-Buffer design during the fabrication,which reduces 2 mask layers and 2 steps compared to the conventional process.The properties of the buffer region surrounding the drain terminal of devices affect the device performance significantly.Experimental and numerical simulation results that device with Shared-Buffercan achieves equivalent performance as original design through process and layout optimization.

Key words: SOI, LIGBT, PLDMOS, shared-buffer

中图分类号: