中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2021, Vol. 21 ›› Issue (3): 030205 . doi: 10.16257/j.cnki.1681-1070.2021.0315

• 封装、组装与测试 • 上一篇    下一篇

脱模剂(蜡)对EMC/红胶体系间密着性影响的研究

李泽亮;刘艳明;王殿年;杨春梅;郭本东   

  1. 长兴电子材料昆山有限公司,江苏 苏州 215301
  • 收稿日期:2020-11-05 出版日期:2021-03-23 发布日期:2020-12-16
  • 作者简介:李泽亮(1995—),男,山西临汾人,工学硕士,现主要从事环氧模塑料的研究与开发。

Study on the Effect ofMold Release Agent (Wax) on the Adherence of EMC/Adhesives System

LI Zeliang, LIU Yanming, WANG Diannian, YANG Chunmei, GUO Bendong   

  1. Eternal Electronic Materials Kunshan Co. Ltd., Suzhou 215301, China
  • Received:2020-11-05 Online:2021-03-23 Published:2020-12-16

摘要: 当前电子产品正趋于小型化、微型化,这对适用于小型化的表面贴装电子元器件的要求越来越高。因此,研究环氧模塑料(Epoxy Molding Compound, EMC)对改善元器件贴装的可靠性,提高最终产品的质量具有重要意义。以EMC最常用的邻甲酚型环氧树脂(OCN)和酚醛树脂(PN)为树脂系统,选用8种不同类型的蜡为单一变量设计配方合成了EMC,以所述测试方法测试了EMC与红胶的密着力,其中5种蜡符合标准,并分析得到了蜡的类型对EMC与红胶密着力的影响规律。结合离型测试,分析了不同类型的蜡在EMC生产和使用过程中的作用。结果表明,在该树脂系统中,蜡3、4、5、6为主蜡,蜡1、7、8为辅蜡。在EMC层面上解决了红胶密着力问题,同时对提高EMC生产过程中的操作性具有一定的意义。

关键词: ?环氧模塑料, 蜡, 红胶, 密着性

Abstract: At present, electronic products tend to be miniaturized, so the requirements for surface mount devices are getting higher and higher. The research on the EMC used for components is of great importance for improving the reliability of the patch and the quality of the final product. The o-cresol novolac epoxy resin (OCN) and phenolic resin (PN), the most commonly used for EMC, were used as the resin system, and eight various types of waxes were selected as the single variable design formula to synthesize EMC. The EMC/adhesives adhesion force was tested by the test method described, among which 5 kinds of waxes met the thrust criterion, and the influence law of wax types on EMC/adhesives adhesion force was analyzed. Combined with release test, the effects of various types of waxes in EMC production and use were analyzed. And the results showed that in the resin system, waxes 3, 4, 5 and 6 were the main waxes, and waxes 1, 7 and 8 were the auxiliary waxes. The problem of adhesives adherence is solved in the aspect of EMC, and it has certain significance to improve the operability of EMC production process.

Key words: epoxymoldingcompound, wax, adhesives, adherence

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