晶圆键合设备对准和传送机构研究综述

doi:10.16257/j.cnki.1681-1070.2024.0021

电子与封装 ›› 2024, Vol. 24 ›› Issue (3): 030201 . doi: 10.16257/j.cnki.1681-1070.2024.0021

• 封装、组装与测试 • 下一篇

晶圆键合设备对准和传送机构研究综述

吴尚贤¹,王成君²,王广来¹,杨道国¹

1.桂林电子科技大学机电工程学院，广西桂林 ?541004；2. 中国电子科技集团公司第二研究所，太原 ?030024

收稿日期:2023-08-28 出版日期:2024-03-27 发布日期:2024-03-27
作者简介:吴尚贤（1997—），男，黑龙江哈尔滨人，硕士，主要从事晶圆键合卡盘方向的研究。

Review of Research on Alignment and Transfer Mechanism for Wafer Bonding Devices

WU Shangxian¹, WANG Chengjun², WANG Guanglai¹, YANG Daoguo¹

1. School of Mechanical and ElectricalEngineering, Guilin University ofElectronic Technology, Guilin 541004, China; 2. The 2nd Research Institute of China Electronics Technology Group Corporation, Taiyuan030024, China

Received:2023-08-28 Online:2024-03-27 Published:2024-03-27

摘要/Abstract

摘要： 随着微机电系统和3D集成封装的快速发展，多功能高性能器件、小体积低功耗器件、耐高温耐高压器件以及小型化高集成度器件是目前封装领域研究的重点。晶圆键合设备对于这些高性能、多功能、小型化、耐高温、耐高压、低功耗的集成封装器件的量产起着至关重要的作用，因此对晶圆键合设备及其对准机构和传送机构的研究也十分重要。介绍了常用的晶圆键合设备与晶圆键合工艺、对准机构和传送机构的工作原理以及主要的晶圆键合设备厂商现状，同时对晶圆键合设备对准和传送机构的发展趋势进行展望，其未来将朝着高精度、高对准速度、高吸附度和高可靠性的方向发展。

关键词: 晶圆键合, 键合工艺, 对准机构, 传送机构

Abstract: With the rapid development of micro-electro-mechanical system and 3D integrated packaging, multifunctional and high-performance devices, small volume and low-power devices, high temperature and high voltage resistance devices, and miniaturized highly integrated devices are currently the focus of research in the packaging field. Wafer bonding devices play a crucial role in the mass production of these high-performance, multifunctional, miniaturized, high temperature resistant, high voltage resistant, and low-power integrated packaging devices, so the research on wafer bonding equipment and its alignment and transfer mechanism is also very significant. The commonly used wafer bonding equipment and wafer bonding process, the working principle of alignment and transfer mechanism, and the research status of main wafer bonding equipment manufacturers are introduced. At the same time, the development trend of wafer bonding equipment alignment and transfer mechanism is prospected, and it will develop in the direction of high precision, high alignment speed, high adsorption and high reliability.

Key words: wafer bonding, bonding process, alignment mechanism, transfer mechanism

中图分类号:

TN405

吴尚贤,王成君,王广来,杨道国. 晶圆键合设备对准和传送机构研究综述[J]. 电子与封装, 2024, 24(3): 030201 .

WU Shangxian, WANG Chengjun, WANG Guanglai, YANG Daoguo. Review of Research on Alignment and Transfer Mechanism for Wafer Bonding Devices[J]. Electronics & Packaging, 2024, 24(3): 030201 .

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晶圆键合设备对准和传送机构研究综述

Review of Research on Alignment and Transfer Mechanism for Wafer Bonding Devices

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