中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2022, Vol. 22 ›› Issue (6): 060201 . doi: 10.16257/j.cnki.1681-1070.2022.0607

• 封装、组装与测试 • 上一篇    下一篇

电子封装中激光封焊工艺及性能研究

王晓卫;唐志旭   

  1. 振华微电子有限公司,广东 深圳? 518000
  • 收稿日期:2021-09-15 出版日期:2022-06-23 发布日期:2022-01-25
  • 作者简介:王晓卫(1983—),男,山东烟台人,硕士,高级工程师,主要研究方向为电子封装技术。

Research on Process and Performance of Laser Sealing in ElectronicPackaging

WANG Xiaowei, TANG Zhixu   

  1. Zhenhua Microelectronics Co., Ltd., Shenzhen 518000, China
  • Received:2021-09-15 Online:2022-06-23 Published:2022-01-25

摘要: 研究了激光封焊中光子激发电子发生跃迁的能量转变及传递过程与工艺参数之间的关系,并分析了外壳吸收能量与熔深、工艺参数之间的联系。结果表明,随着熔深的增加,能量呈指数形式衰减,到达封焊临界点后,封焊终止。通过改变激光波形、功率、脉宽、速度、频率和离焦量等工艺参数,可以控制焊材的电子跃迁和能量传递过程。合理控制熔融时的金属蒸汽、熔池宽度和深度,从而对封焊裂纹、气孔和烧蚀等缺陷进行合理控制,以达到气密性和机械可靠性试验要求。

关键词: 熔深, 激光波形, 气密性

Abstract: The relationship between the energy transformation and transfer process of photon excited electron and process parameters in laser sealing is studied, and the relationship between shell absorbed energy, penetration and process parameters is also analyzed. The results show that the energy decreases exponentially with the increase of penetration, and the welding is terminated after reaching the critical point. By changing the laser waveform, power, pulse width, speed, frequency, defocusing amount and other process parameters, the electronic transition and energy transfer process of the welding materials can be controlled. In order to meet the requirements of air tightness and mechanical reliability test, it is necessary to reasonably control the metal vapor, width and depth of molten pool during melting, so as to control the defects such as weld crack, porosity and ablation.

Key words: penetration, laserwaveform, airtightness

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