中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2023, Vol. 23 ›› Issue (4): 040204 . doi: 10.16257/j.cnki.1681-1070.2023.0032

• 封装、组装与测试 • 上一篇    下一篇

双层基板塑封器件的声扫检查方法研究

田健;廖登华;李永梅;马清桃   

  1. 湖北航天技术研究院计量测试技术研究所,湖北 孝感 432000
  • 收稿日期:2022-07-01 出版日期:2023-04-27 发布日期:2022-12-14
  • 作者简介:田健(1985—),男,湖北天门人,高级工程师,从事元器件可靠性分析工作。

Study on Acoustic Scanning Inspection Methodof Plastic Encapsulated Devices on Double-Layer Substrates

TIAN Jian, LIAO Denghua, LI Yongmei, MA Qingtao   

  1. The Metrologyand Measurement Institute of Hubei Space Academy,Xiaogan 432000,China
  • Received:2022-07-01 Online:2023-04-27 Published:2022-12-14

摘要: 在对双层基板塑料封装器件进行扫描声学显微镜检查时,对器件结构和声扫设备成像了解不充分,容易导致误判。对ACTEL公司生产的2款双层基板结构的FPGA器件进行化学开封和物理解剖分析,同时从器件检测波形特点、声扫图像特征、同类器件对比验证等多个方面进行综合分析及验证。指出当门限内包含2个及以上主波信号时应关注器件的封装结构,在充分了解器件结构后,通过门限设置选定与关注界面对应的界面波,再进行声扫即可得出正确的结果。

关键词: 双层基板, 塑封器件, 扫描声学显微镜, 分层假象

Abstract: When scanning acoustic microscope is used to inspect plastic encapsulated devices on double-layer substrates, the understanding of device structure and acoustic scanning equipment imaging is insufficient, which is easy to lead to misjudgement. Through chemical unsealing and physical anatomy analysis of two kinds of FPGA devices with double-layer substrate structure produced by ACTEL Company. At the same time, comprehensive analysis and verification are carried out from many aspects, such as the characteristics of device detection waveform, the characteristics of acoustic scanning image, and the comparative verification of similar devices.It is pointed out that when the threshold contains two or more main wave signals, the package structure of the device should be paid attention to. After the device structure is fully understood, the interface wave corresponding to the focus interface is selected through the threshold setting, and then the correct result can be obtained by acoustic scanning.

Key words: double-layer substrates, plastic encapsulated devices, scanning acoustic microscopy, stratified illusion

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