关键词: 电源分配网络, SIwave, ADS, 封装电容, 球形栅格阵列（BGA）封装

Abstract: In the packaging design of products such as FPGA, CPU, graphic processing unit (GPU) and digital signal processing (DSP), not only the integrity of the signal needs to be considered, but also the power distribution network needs to be considered. Integrated circuit packaging can increase the inductance of the chip power network, leading to a decrease in chip performance and affecting the quality of the device. Due to the limitation of packaging space and the requirements of substrate impedance, it is critical to meet the chip performance requirements to mount a designed decoupling capacitor on the packaging substrate to reduce the impedance. SIwave and ADS and other software tools are used to simulate the distribution network, both time-domain and frequency-domain analysis methods can quickly locate whether the entire power supply network meets the power supply needs of the chip.

Key words: power distribution network, SIwave, ADS, package capacitor, ball grid array(BGA)