中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2018, Vol. 18 ›› Issue (6): 12 -16. doi: 10.16257/j.cnki.1681-1070.2018.0062

• 封装、组装与测试 • 上一篇    下一篇

基于ATE的ADSP测试

武乾文,奚留华,张凯虹   

  1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214035
  • 出版日期:2018-06-20 发布日期:2020-02-19
  • 作者简介:武乾文(1968—),男,江苏无锡人,高级工程师,1991年毕业于电子科技大学,为国内DSP测试专家。

ADSP Testing Based on ATE

WU Qianwen, XI Liuhua, ZHANG Kaihong   

  1. China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214035, China
  • Online:2018-06-20 Published:2020-02-19

摘要: 随着集成电路技术的飞速发展,ADSP的应用越来越广泛,其测试技术得到广泛的重视及研究。简要介绍了ADSP的重要组成部分,提出一种ATE对ADSP测试的方法。ADSP的测试包括功能测试、直流参数测试及交流参数测试,其中功能测试对ADSP是至关重要的。以ADSP-TS201S为例,其功能测试是通过Ultra Edit软件编辑生成测试码,导入测试仪器,对被测器件进行地址叠加操作,以检查其功能。主要讲述ADSP功能及交流参数测试的关键技术及其注意事项。

关键词: ATE, ADSP, 测试, 功能, 交流参数

Abstract: With the rapid development of integrated circuit technology, the application of ADSP is becoming more and more extensive. Testing technology of integrated circuit has been paid more and more attention. The paper briefly introduces the important components of ADSP, and puts forward the way of testing ADSP by ATE.ADSP testing includes functional testing, DC parameter testing, AC parameter testing. Functional testing is essential for ADSP. For example, functional code of ADSP-TS201S is edited by Ultra Edit software and imported into test equipment. Address overlay operation of the device is performed to check its function. The key technology and announcements of function testing and AC parameters testing of ADSP are mainly stated.

Key words: ATE, ADSP, testing, function, AC parameter

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