关键词: 倒装芯片, 焊接机构, 精度补偿, 热形变, 神经网络

Abstract: Solderingmechanism and working process of the flip chip equipmentare introduced briefly.The mechanical structure of the soldering mechanism is analyzed to produce the mechanism of large thermal error in the placement accuracy, and compensation measures are proposed.Through the Ansys finite element analysis software to simulate the temperature change state of the effective heat generating points of the soldering mechanism, and find the temperature critical points.A wireless patch type thermal resistance temperature sensor is used to detect the temperature of the key points of the soldering mechanism and the position deviations of the upshot and downshot visual system to establish a neural network thermal error model.The verification results indicate that this method ensures the precision deviations of the flip chip equipment are within ±10 μm in the x and y directions.The process capability index C_pk in the x direction reaches 1.310, and the C_pk in the y direction reaches 1.697, which meets the basic requirements of the equipment.

Key words: flip chip, soldering mechanism, precision compensation, thermal deformation, neural network