中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2019, Vol. 19 ›› Issue (1): 09 -12. doi: 10.16257/j.cnki.1681-1070.2019.0003

• 封装、组装与测试 • 上一篇    下一篇

老炼板不良的引入与检查

郁骏,邵振宇,宋均   

  1. 中国电子科技集团公司第五十八研究所,江苏 无锡 214035
  • 收稿日期:2018-10-09 出版日期:2019-01-21 发布日期:2019-01-21
  • 作者简介:郁骏(1990—),江苏无锡人,学士,2012年毕业于淮海工学院,主要从事集成电路及分立器件老炼技术及二次筛选工作。

The Introduction and Inspection of Bad Welding

YU Jun, SHAO Zhenyu, SONG Jun   

  1. China Electronics Technology Group Corporation No.58 Research Institute, Wuxi 214035, China
  • Received:2018-10-09 Online:2019-01-21 Published:2019-01-21

摘要: 老炼、寿命试验作为元器件筛选、考核鉴定过程中不可缺少的一项,老炼板的可靠性是决定试验结果的重要因素。焊接作为老炼板组装过程的重要环节,焊接的质量直接关系到老炼板在整个试验过程中的可靠性和稳定性。通过对焊接过程中可能产生的不良现象进行分析,归纳不良产生的原因,总结出一套规范有效的焊接方法和老炼板检查流程,确保老炼板在筛选、考核鉴定过程中的可靠性。

关键词: 焊接, 老炼试验, 老炼板, 可靠性

Abstract: Aging and life testing are indispensable in the selection and qualification of components. The reliability of aging boards is an important factor in determining the test results. Welding is an important part in the assembly process of the aging plate. The quality of welding is directly related to the reliability and stability of the old plate in the whole test process. By analyzing the bad phenomena that may occur during the welding process, the causes of bad production are summed up, and a set of standard and effective welding methods and the inspection process of old plate are summed up to ensure the reliability of the old plate in the process of screening and assessment.

Key words: welding, aging test, aging plate, reliability

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