关键词: 锡膏, 焊接空洞, 回流焊

Abstract: Solder print and reflow is one important process in package assembly, and solder void is a very common and serious issue in traditional reflow process. It’s very difficult to solve especially for some QFN and die with bigger solder area. By analyzing the process properties, the root-cause of solder void is identified. DOE is used to find and optimize the main effect factors to improve solder void. By introducing two times reflow process and optimized parameters, the solder void coverage is reduced to less than 5%, and die crack issue which cause as solder void is solved, which provides the solution of solder void for common solder print and reflow process.

Key words: solder paste, solder void, reflow