关键词: 芯片埋入式, 封装, 界面分层, 内聚力模型, 回流焊, ANSYS仿真

Abstract: The difficulty of embedded chip packaging technology is mainly concentrated on a series of adverse effects on the dies caused by the packaging manufacturing process, such as cracks, delamination, warpage, ESD, etc. The special structure of the embedded die substrate greatly increases the difficulty of the packaging process. This research first establishes a simplified model based on the polyimide delamination phenomenon of the chip during the development process, and then uses the cohesive unit in the ANSYS tool to simulate the interface de-bonding process, and analyzes the equivalent stress value distribution of the model. The results show that the PI-RDL material cannot withstand the thermal stress during the package reflow process. Finally, the influence of different material thicknesses on thermal stress is analyzed, which provides a theoretical reference for the development of embedded chip packaging.

Key words: embeddedchip, package, interfacedelamination, cohesivezonemodel, reflow, ANSYS