中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2020, Vol. 20 ›› Issue (12): 120101 . doi: 10.16257/j.cnki.1681-1070.2020.1210

• 综述 •    下一篇

后摩尔时代的技术创新

许居衍1;黄安君2   

  1. 1.中国电子科技集团公司第五十八研究所,江苏 无锡 214072;2. 华虹半导体(无锡)有限公司,江苏 无锡 214000
  • 收稿日期:2020-07-30 发布日期:2020-09-24
  • 作者简介:许居衍(1934—),男,福建福州人,中国工程院院士,中国电子科技集团公司第五十八研究所名誉所长,长期从事半导体技术与工业的开发工作,研制成功中国第一代单片硅平面集成电路制造技术,曾获全国科学大会奖、国防科技进步奖,部、省级科技进步奖多项。

TechnologicalInnovation in the Post-Moore Law Period

XU Juyan1, HUANG Anjun2   

  1. 1. China Electronic Technology Group Corporation No.58 ResearchInstitute, Wuxi 214072, China; 2. Huahong Semiconductor (Wuxi) Co., LTD., Wuxi 214000, China
  • Received:2020-07-30 Published:2020-09-24

摘要: 从半导体技术与架构分类的角度出发,在科技范式的高度揭示了后摩尔时代百花斗艳的创新图象。基于硅CMOS技术和冯·诺依曼计算架构所形成的“硅-冯”范式,仍将长期主导电子信息产业的发展,但创新主体已从技术转向架构。与此同时,在冯氏架构下,探索类同硅CMOS的器件技术创新(“类硅”模式)和采用硅CMOS技术模拟脑神经的非冯架构创新(“类脑”模式)也在应用推动下得到快速发展。现行架构下的新兴技术创新和现行技术下的新兴架构创新终将迎来技术与架构全新的颠覆性创新(“新兴”范式),从而再一次回归到物理基础创新。

关键词: 摩尔定律, 硅-冯范式, 类硅模式, 类脑模式, 异构集成, 芯粒

Abstract: From the perspective of semiconductor technology and architecture classification, the article reveals the blossoming innovation landscape in the post-Moore Law Period from the height of the technology paradigm. The discussion points out that the "silicon-Von" paradigm based on silicon CMOS technology and Von Neumann computing architecture will continue to dominate the development of the electronic information industry for a long time, but the main body of innovation has shifted from technology to architecture. At the same time, device innovations exploring silicon-like CMOS technology ("silicon-like" paradigm) and non-Von architectures using silicon-based CMOS technology to simulate the brain ("brain-like" paradigm) are also rapidly gaining momentum driven by applications in the Von architectures. Emerging innovations in current architectures and emerging architectural innovations in current technologies will eventually usher in new and disruptive innovations in technology and architecture ("emerging" paradigm) that will once again return to the physical foundations of innovation.

Key words: Moore'slaw, silicon-Vonparadigm, silicon-likemodel, brain-likemodel, heterogeneousintegration, chiplet

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