关键词: CMOS图像传感器, 装片工艺, 装片胶, 有限元分析

Abstract: Warpage of CMOS image sensor die are strictly controlled. In this paper, the die attach structure of a supper large imaging sensor chip is studied first, so as to further optimize the material properties of the adhesive through residual stress analysis. The best adhesive is selected by comparison of several common adhesives.Finally,the die attach process parameters are optimized.The die warpage is successfully controlled to be lower than 10 μm, meeting the warpage requirement (<20 μm) and reliability qualification.

Key words: CMOSimagesensor, dieattachment, adhesive, finiteelementanalysis