焊接参数对Au80Sn20焊料封装孔洞和微观组织的影响
颜炎洪;徐衡;王英华;陈旭;李守委;刘立恩
Effect of Soldering Parameters on Pores and Microstructureof Au80Sn20 Solder Package
YAN Yanhong, XU Heng, WANG Yinghua, CHEN Xu, LI Shouwei, LIU Lien
电子与封装
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2022, (4): 40203
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DOI: 10.16257/j.cnki.1681-1070.2022.0414
