碳化硅器件封装进展综述及展望*
杜泽晨;张一杰;张文婷;安运来;唐新灵;杜玉杰;杨霏;吴军民
Review and Prospect of SiC Device Packaging
DU Zechen, ZHANG Yijie, ZHANG Wenting, AN Yunlai, TANG Xinling, DU Yujie, YANG Fei, WU Junmin
电子与封装
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2022, (5): 50102
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DOI: 10.16257/j.cnki.1681-1070.2022.0502
