多次回流焊后金属间化合物及焊点强度分析

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常青松, 徐达, 袁彪, 魏少伟

Analysis of Intermetallic Compounds and Solder Joint Strength AfterMultiple Reflow Soldering

CHANG Qingsong, XU Da, YUAN Biao, WEI Shaowei

电子与封装 . 2023, (8): 80207 - . DOI: 10.16257/j.cnki.1681-1070.2023.0114