基于陶瓷基板微系统T/R组件的焊接技术研究

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王禾,周健,戴岚,张丽

Research onWelding Technology for Micro-System T/R ComponentsBased on Ceramic Substrates

WANG He, ZHOU Jian, DAI Lan, ZHANG Li

电子与封装 . 2023, (11): 110202 - . DOI: 10.16257/j.cnki.1681-1070.2023.0144