有机封装基板界面处理工艺对结合强度与可靠性的影响
梁梦楠,陈志强,张国杰,姚昕,李轶楠,张爱兵
Effect of Interface Processing Technology on Bonding Strength and Reliability of Organic Package Substrate
LIANG Mengnan, CHEN Zhiqiang, ZHANG Guojie, YAO Xin, LI Yi´nan, ZHANG Aibing
电子与封装
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2024, (2): 20105
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DOI: 10.16257/j.cnki.1681-1070.2024.0037
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