基于压力辅助烧结方法改善LTCC基板翘曲的研究
杨兴宇,马其琪,张艳辉,贾少雄
Research on Improving Warpage of LTCC Substrates Based on Pressure-Assisted Sintering Method
YANG Xingyu, MA Qiqi, ZHANG Yanhui, JIA Shaoxiong
电子与封装
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2024, (4): 40205
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DOI: 10.16257/j.cnki.1681-1070.2024.0042
