全彩LED封装用环氧模塑料的固化动力学研究
余灿煌，朱 琼，杜和武，罗永祥，石逸武
Study on Curing Kinetics of Epoxy Molding Compound Using for Full Color LED Package
YU Canhuang, ZHU Qiong, DU Hewu, LUO Yongxiang, SHI Yiwu
电子与封装
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2018, (11): 5
-8
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DOI: 10.16257/j.cnki.1681-1070.2018.0118
