关键词: 非等温DSC法, 固化动力学, 环氧模塑料

Abstract: The curing system of o-cresol formaldehyde epoxy resins/phenolic resin used in traditional epoxy molding compound for semiconductor packaging is different from the curing system of aliphatic epoxy resin/anhydride curing system used in full-color LED packaging,which has advantages such as high light transmittance,good toughness and high temperature and humidity resistance.With the change of curing system,it is of great significance to find new and optimal curing process.In this paper,the curing kinetics of 8183 epoxy resin/anhydride curing system was studied by non-isothermal DSC method,and the curing kinetics of 8183 epoxy resin/anhydride curing system was compared with that of 5183 commercial EMC produced.The activation energy,reaction series and curing temperature were obtained by experiments.According to the best curing conditions obtained in the study,both of them were subjected to high temperature curing and the basic performance data of both were measured,which provided a scientific basis for determining the best curing conditionsof8183 epoxy molded plastics.

Key words: non-isothermalDSC, curing kinetics, epoxy molding plastics