基板非圆过孔的信号完整性和电源完整性研究

导航

刘琦，刘卫东，陈兴隆，王昕捷

The Development of Signal Integrity and Power Integrity for Via of Package Substrate

LIU Qi,LIU Weidong,CHEN Xinglong,WANG Xinjie

电子与封装 . 2017, (12): 5 -8 . DOI: 10.16257/j.cnki.1681-1070.2017.0139