关键词: 芯片封装, 过孔, 电源完整性, 信号完整性

Abstract: With the development of since and technology,the power supply the voltage of semiconductor chip is lower and lower,the current is more and more higher and the signal speed is faster and faster to result in the problem of power integrity and signal integrity getting increasingly prominent.it is not neglectful for package due to the main sources of power integrity and signal integrity problem of an electronic system include in die，package，connector，backplane,etc.If via being as a passageway between different layers of interconnection in package substrate can't design well,the serious power integrity and signal integrity problem will arise.In this paper，signal integrity and power integrity of noncircular via used to package substrate are researched,and discussingthe applicationbackgroundandthe equivalentcircular via ofnoncircular via.

Key words: chip package, via, power integrity, signal integrity