三维封装中的并行键合线信号仿真分析

导航

王祺翔^1,2,3，曹立强^1,2,3，周云燕^1,3

The Simulation Analysis of Parallel Bonding Wire Signal in a 3D System-in-Package

WANG Qixiang^1,2,3, CAO Liqiang^1,2,3, ZHOU Yunyan^1,3

电子与封装 . 2017, (3): 13 -18 . DOI: 10.16257/j.cnki.1681-1070.2017.0030