关键词: 键合线, 系统级封装, DDR, 单端信号, 差分信号

Abstract: Today’s portable electrical devices can run at gigabits per second (Gbps), but the bandwidth of the channel limits its performance. Among all the transmission structures between the chips and substrates, the bonding wire is the most commonly used， but it is becoming a major bandwidth constraint. This paper is based on the research and development project of high-density wiring System-in-Package. Modeling analysis is conducted with the full?wave electromagnetic field simulation tools to research the influences of different parameters on DDR single-ended and differential signal transmission quality of the bonding wire transmission line. Finally, through the optimization of bonding wire design, the simulation results were verified by eye diagram.

Key words: bonding wire, System-in-Package, DDR, single-ended signal, differential signal