热学环境下2.5D封装器件60Pb40Sn互连焊点可靠性研究
文惠东，张代刚，刘建松，徐士猛
Study on 60Pb40Sn Solder Joints Reliability of 2.5D Package Device in Thermal Environment
WEN Huidong, ZHANG Daigang, LIU Jiansong, XU Shimeng
电子与封装
.
2019, (9): 5
-9
.
DOI: 10.16257/j.cnki.1681-1070.2019.0902
