关键词: 2.5D封装, 含铅焊点, 可靠性

Abstract: 2.5D package technology has been widely used in high-performance IC due to its characteristics of fast signal transmission speed and high package density. At present, lead-free solder are usually adopt as joints in 2.5D device, which don’t meet the requirement that content of Pb in solder joints of spaceborne device should be more than 3%. In this paper, 60Pb40Sn were used as micro-solder between silicon interposer and upper chip in 2.5D package device, and reliability of 60Pb40Sn solder joints was assessed. The main conclusion is that the daisy devices passed continuity tests after 1000 temperature cycles(-65℃～150℃), 1000 hours of stabilization bake(150℃) and 500 thermal shocks(-65℃～150℃), which tentatively verified the feasibility of 60Pb40Sn solder in 2.5D package device.

Key words: 2.5D package, leaded solder joint, reliability assessment