中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

导航
基于COB封装技术的手机摄像模组DA胶画胶设计
王明珠,姚立锋,赵波杰,李凤云,蒋恒
Mobile Phone Camera Module DA Glue Painting Design based on COB Packaging Technology
WANG Mingzhu, YAO Lifeng, ZHAO Bojie, LI Fengyun, JIANG Heng
电子与封装 . 2019, (9): 15 -18 .  DOI: 10.16257/j.cnki.1681-1070.2019.0904