横向超结器件耐压与比导的优值仿真与实验验证
杨昆;乔明;何俊卿;王睿
Simulation and Experimental Verification of theOptimal Values of Voltage and Specific Conductance of Lateral Super JunctionDevices
YANG Kun, QIAO Ming, HE Junqing, WANG Rui
电子与封装
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2020, (10): 100401
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DOI: 10.16257/j.cnki.1681-1070.2020.1003
