DDR3堆叠键合组件的信号完整性分析与优化
曾燕萍;张景辉;王梦雅;孙晓冬;曹春雨
Signal Integrity Analysis and Optimization ofDDR3 Stacked Bonding Module
ZENG Yanping, ZHANG Jinghui, WANG Mengya, SUN Xiaodong, CAO Chunyu
电子与封装
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2020, (12): 120201
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DOI: 10.16257/j.cnki.1681-1070.2020.1202
