基于内聚力模型脱粘仿真的内埋芯片PI分层研究

导航

吴昊平;周青云;胡滢

Research on Delamination of Embedded Chip PI Material Based on CohesionZone Model De-Bonding Simulation

WU Haoping, ZHOU Qingyun, HU Ying

电子与封装 . 2021, (4): 40206 - . DOI: 10.16257/j.cnki.1681-1070.2021.0410