AuSn20焊料在集成电路密封中形成空洞的研究*
马艳艳;赵鹤然;田爱民;康敏;李莉莹;曹丽华
Voids inAuSn20 Solder During the Integrated Circuit Sealing Process
MA Yanyan, ZHAO Heran, TIAN Aimin, KANG Min, LI Liying, CAO Lihua
电子与封装
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2021, (5): 50206
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DOI: 10.16257/j.cnki.1681-1070.2021.0513
