长期湿热环境下塑封电路Au-Al键合退化研究
陈光耀;虞勇坚;戴莹;邹巧云;吕栋;陆坚
Research onAu-Al Bonding Degradation of Plastic Encapsulated Microelectronics in RepeatedHygrothermal Environment
CHEN Guangyao, YU Yongjian, DAI Ying, ZOU Qiaoyun, LYU Dong, LU Jian
电子与封装
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2021, (7): 70201
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DOI: 10.16257/j.cnki.1681-1070.2021.0701
