三维封装TSV结构热失效性分析
宋培帅;何昱蓉;魏江涛;杨亮亮;韩国威;王晓东;杨富华
ThermalFailure Analysis of Three Dimensional Packaging-Through Silicon Via Structure
SONG Peishuai, HE Yurong, WEI Jiangtao, YANG Liangliang, HAN Guowei, WANG Xiaodong, YANG Fuhua
电子与封装
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2021, (9): 90201
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DOI: 10.16257/j.cnki.1681-1070.2021.0902
