关键词: X波段, T组件, 多功能芯片, 腔体效应, 相位精度

Abstract: An X-band high power 4-channel T module for phased array antenna is presented in the paper. The principle, design idea and micro-assembly processes are discussed. In order to reduce the module volume, the multifunction-chip integrates several monolithic microwave integrated circuits (MMICs). The weak cavity effect enables reasonable placement of circuit units in the module architecture. In the micro-assembly processes, reasonable temperature gradients and assemble technology are used to control product reliability. The rest results show that output power of the T module is more than 6 W and less than 3° of root mean square (RMS) phase error in the range of 9 GHz~12 GHz.

Key words: X-band, transmit module, multifunction-chip, cavity effect, phase shift accuracy