中国半导体行业协会封装分会会刊

中国电子学会电子制造与封装技术分会会刊

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电子与封装 ›› 2017, Vol. 17 ›› Issue (7): 43 -47. doi: 10.16257/j.cnki.1681-1070.2017.0091

• 微电子制造与可靠性 • 上一篇    

多种宽带传输结构的研究与分析

赵逸涵,史源,钱兴成   

  1. 单片集成电路与模块国家重点实验室,南京电子器件研究所,南京 210016
  • 出版日期:2017-07-20 发布日期:2017-07-20
  • 作者简介:赵逸涵(1992—),男,江苏南京人,2014年毕业于武汉理工大学电子与科学技术专业,现为南京电子器件研究所在读硕士研究生,从事宽带微波射频电路研究。

Research and Analysis of Several Wide-Band Transmission Structures

ZHAO Yihan, SHI Yuan, QIAN Xingcheng   

  1. National key laboratory of integrate circuits and module, Nanjing Electronic Devices Institute, Nanjing 210016, China
  • Online:2017-07-20 Published:2017-07-20

摘要: 针对宽带高频组件的发展趋势,研究了三种不同的适用于宽带高频信号的传输结构。主要介绍了三种传输结构的设计方案,并利用HFSS软件对传输结构进行仿真优化,最后进行了实物分析验证。经过测试,在宽带高频信号下,三种结构均有比较良好的电性能传输特性。该测试结果表明,宽带高频组件的设计中可以根据实际需求运用多种传输结构实现较高的性能指标,具有广泛的应用前景。

关键词: 宽带高频, 传输结构, HFSS仿真

Abstract: Proceeding from the development path of wide-band and high-frequency components, the paper conducts certain researches and presents designs of three different transmission structures for wide-band and high-frequency signal. The HFSS software is used to stimulate and optimize the structure of transmission. Three structures of transmission are verified and analyzed practically. After tests, three structures all have a high electronic quality. The structures can be applied flexibly in scenarios with various requirements to achieve higher electronic performance in the design of the wide-band and high frequency components. The structures will be widely applied in many fields.

Key words: wide-band and high-frequency, transmission structure, HFSS stimulation

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